Imprint method, imprint apparatus, and article manufacturing method

ABSTRACT

An imprint method includes an inspection step of inspecting a substrate to obtain information of a foreign substance on the substrate; and a film forming step of forming a film covering the foreign substance, using the information of a foreign substance on the substrate, wherein the film forming step is performed before the contact step.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an imprint method, imprint apparatus,and article manufacturing method.

2. Description of the Related Art

The imprint technique is a technique that makes transfer of nanoscalemicropatterns possible, and is beginning to be put into practical use asone nanolithography technique for the mass-production of magneticrecording media and semiconductor devices. An apparatus such as anelectron-beam exposure apparatus is used to form, on the mesa surface ofa mold, patterns of a shot region to be transferred by the imprinttechnique. A mold having patterns formed by using an apparatus such asan electron-beam exposure apparatus is imprinted as an original on asubstrate such as a silicon wafer or glass plate as a pattern transfertarget, thereby transferring the patterns. These micropatterns areformed by coating the substrate with an imprinting resin (dispensing theresin on the substrate), and curing the resin while the patterns of themold are pressed against the substrate with the resin being sandwichedbetween them.

Imprint techniques presently put into practical use are the heat cyclemethod and photo-curing method. In the heat cycle method, while thefluidity of a thermoplastic resin is increased by heating the resin to atemperature equal to or higher than the glass-transition temperature, amold is pressed against a substrate with the resin being sandwichedbetween them. After the resin is cooled, patterns are formed on theresin by releasing the mold from the resin. On the other hand, thephoto-curing method uses an ultraviolet-curing resin. While a mold madeof a light-transmitting material such as quartz is pressed against aresin dispensed on the substrate, the resin is cured by ultravioletirradiation, and patterns are formed on the cured resin by releasing themold from the resin. In the heat cycle method, the transfer timeincreases due to temperature control, and the dimensional accuracy andpositional accuracy decrease due to a temperature change. However, thephoto-curing method has no such problems. Therefore, the photo-curingmethod is advantageous in the mass-production of nanoscale semiconductordevices.

Various imprint apparatuses have been implemented in accordance withresin curing methods and applications. As an apparatus formass-producing semiconductor devices and the like, an apparatus usingjet and flash imprint lithography (JFIL) is effective. An imprintapparatus fitted for JFIL is disclosed in Japanese Patent Laid-Open No.2009-266841. This imprint apparatus includes a substrate stage, resincoating mechanism, imprint head, light irradiation system, andpositioning alignment mark detecting mechanism. The apparatus uses astep-and-repeat method as in an exposure apparatus because the area of ashot region to be imprinted by one imprint operation is limited.

As an application of the imprint technique to semiconductors, a firstpossible application is to memory elements. The problem of memoryelements is to reduce the cost by mass-production, and the most effectmethod of cost reduction is micropatterning. As is well known, theimprint technique is highly capable of micropatterning, and best suitedto the need of memory elements. A defect of imprint processing is a highrisk of decreasing the yield of semiconductor production. Examples ofmold defects are a mold break caused by a particle adhered on a wafer,and clogging that occurs if a cured resin partially remains on a moldwhen the mold is released from the resin. These mold defectscontinuously cause transfer defects on following shot regions to beimprinted (repetitive defects). Accordingly, it is very important toanalyze cases in which these mold defects occur, and remove the defectsin accordance with the main causes. Japanese Patent Laid-Open No.2009-266841 has proposed a method of coating a dummy wafer with aparticle removing film having high adhesion to a light-curing resin,coating the particle removing film with a light-curing resin, andperforming imprinting, thereby removing particles adhered to a mold byincorporating the particles into the light-curing resin. Also, JapanesePatent Laid-Open No. 2010-69762 has disclosed a method by which if aforeign substance that may break a mold is found on a wafer byinspecting the presence/absence of a foreign substance, imprintprocessing is performed on a shot region including the foreign substanceby switching a mold to a dummy mold for which imprint processing can beperformed.

Presently, however, even when a foreign substance such as a particle ona wafer can be found by an inspection apparatus beforehand, there is nomethod of removing the foreign substance. Therefore, it is necessary toperform imprint processing by using a dummy mold as disclosed inJapanese Patent Laid-Open No. 2010-69762, or perform no imprintprocessing on a shot region where the foreign substance exists. In themethod using a dummy mold, it is difficult to form normally functioningcircuit patterns, but the film thickness after imprinting is maintained.Accordingly, no adverse effect is given to surrounding shot regionsduring etching. However, it is necessary to use another mold support forholding the dummy mold, or switch the molds. This increases theapparatus cost or decreases the productivity. On the other hand, when noimprint processing is performed on a shot region where the foreignsubstance exists, an adverse effect may be given to shot regionsnormally imprinted in a subsequent etching process. Furthermore, neithermethods can produce usable chips from shot regions imprinted by usingthe dummy mold, or from shot regions that are not imprinted. That is, nousable chip can be produced even from a chip region having no foreignsubstance problem, and this decreases the chip yield.

SUMMARY OF THE INVENTION

The present invention provides an imprint method that suppresses thedecrease in throughput and yield even when a foreign substance exists ona substrate.

The present invention in its one aspect provides an imprint methodcomprising a dispensing step of dispensing a resin on a substrate, acontact step of bringing the dispensed resin into contact with a patternsurface of a mold, and a curing step of curing the resin in contact withthe pattern surface, the method further comprising: an inspection stepof inspecting the substrate to obtain information of a foreign substanceon the substrate; and a film forming step of forming a film covering theforeign substance, using the information of a foreign substance on thesubstrate, wherein the film forming step is performed before the contactstep.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view showing the way a film covering a foreign substance isformed in the first embodiment;

FIG. 2 is a view showing the way a film forming material is dropped onthe position of the foreign substance;

FIG. 3 is a view showing the way a film covering a foreign substance isformed in the second embodiment;

FIG. 4 is a view showing another way of dropping a film forming materialon the position of the foreign substance;

FIG. 5 is a view showing the relationship between alignment marks, chipregions, and a shot region;

FIG. 6 is a view showing the driving profile of a mold stage in animprint sequence;

FIG. 7 is a view showing a system including imprint apparatuses;

FIGS. 8A and 8B are views showing the imprint apparatus;

FIG. 9 is a view showing the way a film covering a foreign substance isformed in the third embodiment;

FIG. 10 is a view showing the way a film covering a foreign substance isformed in the fourth embodiment;

FIG. 11 is a view showing the procedure of an imprint method using theJFIL method;

FIG. 12 is a view showing the procedure of an imprint method in a methodof dispensing a resin at once outside an apparatus; and

FIG. 13 is a view showing a procedure of forming a layer covering aforeign substance by jetting molding.

DESCRIPTION OF THE EMBODIMENTS

An imprint method normally includes a coating step of coating(dispensing step of dispensing) a substrate with a resin, a contact stepof bringing the coated resin in contact with the pattern surface of amold, a curing step of curing the resin in contact with the patternsurface, and a releasing step of releasing the mold from the curedresin. The imprint method according to the present invention furtherincludes an inspection step of inspecting the substrate and obtainingforeign substance information such as the presence/absence, size, andposition of a foreign substance on the substrate, and a film formingstep of forming a film covering the foreign substance when it isdetermined in the inspection step that a foreign substance exists. Theimprint method of the present invention including the inspection stepand film forming step will be explained in detail below in the first tofourth embodiments.

First Embodiment

The first embodiment is directed to a technique of mainly protecting amold for semiconductor element imprint lithography. FIG. 1 is aconceptual view showing a method of protecting a mold 6 by forming afilm covering a foreign substance 4 by using a high-viscosity material1. The mold 6 is also called a mask, original, or template. The imprintmethod according to the first embodiment is based on the JFIL methodtouched upon in “BACKGROUND OF THE INVENTION”. Application examplescorresponding to other imprint schemes will be explained from the secondembodiment. Patterns formed on the mesa (pattern surface) of the mold 6are transferred onto a wafer (substrate) 7. As shown in FIG. 2, drops ofan ultraviolet-curing resin (resist) 5 are dispensed from an inkjetdispenser beforehand on a shot region 3 as an imprint processing targetof the wafer 7. The number of the drops of the resin 5 dispensed fromthe inkjet dispenser is generally a number pl. Efforts have been made todecrease the grain size of the resin 5 in order to shorten the fillingtime of the resin 5 during the imprint processing, that is, the timerequired for a gas to disappear from the resin 5 sandwiched between thewafer 7 and recesses of the pattern surface of the mold 6. The height ofthe drops of the resin 5 from the upper surface of the wafer 7 dependson the drop size, and is generally about 1 μm. In an imprint sequence,the pattern surface of the mold 6 is moved close to the shot region 3 onthe wafer 7 coated with the resin 5 as shown in FIG. 2. When the dropsof the resin 5 come in contact with the pattern surface of the mold 6,they spread in the X and Y directions (directions parallel to thepattern surface) of the shot region 3, and draw the pattern surface ofthe mold 6 by the capillary force. Consequently, balance is obtainedwhile maintaining a gap (RLT) between the mold 6 and wafer 7, whichcorresponds to the volume of the dispensed resin like the resin 5 shownin FIG. 1. The value of RLT is determined by the line width of patternsformed on the wafer 7, and generally designed to be about a few ten nm.Although FIG. 1 does not illustrate the pattern surface of the mold 6,patterns of the mold 6 are actually formed on the pattern surface as thelower surface of the mold 6. The wafer 7 is transported to an imprintapparatus through many processes, and foreign substances 4 such asparticles having various sizes sometimes adhere to a circuit formationsurface during the processes. The foreign substance 4 shown in FIG. 1 isan example. When the mold 6 and wafer 7 are made to approach theabove-described RLT width, the diameter of the foreign substance 4adhered on the wafer 7 readily exceeds the RLT width. As a consequence,a contact operation (also called an imprint operation) of bringing theresin 5 and pattern surface into contact with each other may destroy thepattern surface of the mold 6. In the first embodiment, thehigh-viscosity material 1 that has a viscosity higher than that of theresin 5 and protects the mold 6 by forming a film covering the foreignsubstance 4 is dropped in the position of the foreign substance 4 beforethe imprint operation is performed, and the imprint operation isperformed in this state.

The imprint operation requires a syringe (second coating device) 2 as acoating device for dispensing the high-viscosity material 1 as shown inFIG. 2, and an arrangement for obtaining the result of foreign substanceinspection from a foreign substance inspection apparatus. In the imprintoperation, a portion coated with the high-viscosity material 1 risesfrom the surface of the wafer 7, so a portion of the mold 6 whichcorresponds to the portion coated with the high-viscosity material 1 isslightly curved or recessed, but this portion returns to its originalshape after UV exposure and mold release. That is, stress concentratesto a very small area of the pattern surface of the mold 6 and destroysthe pattern surface because the foreign substance 4 exists. In the firstembodiment, therefore, a buffer film is formed by dispensing thehigh-viscosity material 1 around the foreign substance 4. This makes itpossible to protect the pattern surface of the mold 6 by relaxing thelocal concentration of the stress.

The light-curing resin 5 used for imprint lithography generally has aviscosity of 10 to 20 cP. This value is optimized by taking account of aviscosity necessary to maintain the jetting performance of thedispenser, and the fluidity for shortening the filling time when themold 6 and resin 5 are brought into contact with each other. On theother hand, when performing jetting by using a syringe, the viscosity ofthe high-viscosity material 1 can be about 200 to 300 cP for a grainsize of 0.2 μm. Also, when performing jetting by holding a syringenozzle temperature higher than the ambient temperature, the viscosityafter the material lands on the wafer can be held higher whiledecreasing the viscosity during jetting.

FIG. 2 shows the way the high-viscosity material 1 is dropped to coverthe foreign substance 4. When performing imprinting by using the jet andflash imprint lithography (JFIL), a shot region is coated with the resin5 by an inkjet dispenser immediately before imprinting. Assume that theforeign substance 4 exists in the shot region to be imprinted and thesize and position of the foreign substance 4 are known. The syringe 2drops the high-viscosity material 1 on the position where the foreignsubstance 4 exists. The high-viscosity material 1 need not be limited toa high-viscosity material as long as the material has the effect ofrelaxing the concentration of stress by the foreign substance 4 duringthe imprint operation. For example, it is also possible to make thedropping amount of the normal resin 5 around the foreign substance 4larger than that in other regions. When jetting the high-viscositymaterial 1, it is necessary to selectively use the jetting profile ofthe inkjet module of the high-viscosity material 1 and that of thenormal resin 5. Therefore, when the purpose and viscosity of thehigh-viscosity material 1 and the simplicity of the structure are takeninto consideration, a simple jetting mechanism such as the syringe 2 isdesirable. It is also possible to make the high-viscosity material 1contain a fluorescent agent in order to confirm the presence/absence ofthe coating film of the high-viscosity material 1 on the wafer 7 byobservation with a camera of an external apparatus. The foreignsubstance inspection apparatus inspects the wafers 7 one by one, andreports information pertaining to the presence/absence, height,position, and material of the foreign substance 4 to the imprintapparatus. The shot region 3 where the foreign substance 4 is detectedis a target of the process of dropping the high-viscosity material 1.Also, as shown in FIG. 2, one shot region normally includes a pluralityof (in the example shown in FIG. 2, six) chip regions 602, and goodchips need be manufactured from all the chip regions 602 where noforeign substance 4 adheres, without damaging the mold 6.

FIG. 4 shows another mode in which the high-viscosity material 1 shownin FIG. 2 is dispensed. That is, a plurality of points around theforeign substance 4 are coated with the high-viscosity material 1,thereby increasing the area of the buffer film and reducing errors oflanding positions in jetting of the high-viscosity material 1. Thismethod increases the landing accuracy of the high-viscosity material 1.However, if the position of adhesion of the foreign substance 4 is closeto the boundary of the chip region 602 or shot region 3, it is highlylikely that the film made of the high-viscosity material 1 invades anadjacent chip region 602. In either case, the result of the imprintprocessing after the formation of the layer and the film formationinformation are additionally written in a lot processing result reportfor an online host or the like, because these result and information arethe results of automatic processing performed on the wafer 7 by theimprint apparatus.

FIG. 5 is a view in which alignment marks 601 a to 601 h for detectingthe displacement between the shot region 3 and mold 6 by assumingdie-by-die alignment are added to FIG. 2. In a chip region 602 eincluding the region coated with the high-viscosity material 1,displacement may occur in the X and Y directions parallel to the patternsurface due to the rise of the mold 6 caused by the formation of thebuffer film. Therefore, a controller C performs an imprint operationwhile positioning the wafer 7 so as to reduce the displacement betweenthe mold 6 and wafer (substrate) 7 caused by the formation of the bufferfilm. Also, no good chip can be manufactured from the chip region 602 ebecause the foreign substance 4 adheres. By taking account of thesesituations of the chip region 602 e, the information of alignment marksaround the chip region 602 e is not referred to when performing shotregion overlay correction calculations, or the weighting of correctionamount calculations is narrowed. If the reproducibility of the profileof the mold 6 that rises by the high-viscosity material 1 is assured, itis possible to predict a displacement amount that may be produced in theshot region by calculations, and correct the measurement value of analignment scope 9 or the control target value of die-by-die alignment. Ashift error caused by the factor as described above must be taken intoaccount in a method of determining an abnormal value of mark measurementresults. Referring to FIG. 5, of the substrate-side marks 601 a to 601 harranged around the shot region 3, the marks 601 c and 602 d near thechip region 602 e are not used in the overlay correction process evenwhen an alignment measurement value is obtained. That is, the controllerC positions the wafer 7 based on the detection result of displacementbetween the substrate-side marks 601 a, 601 b, and 601 e to 601 h whosedistances to the foreign substance 4 are equal to or larger than apredetermined value, among the plurality of substrate-side marks 601 ato 601 h, and mold-side marks corresponding to these substrate-sidemarks. As described above, the gist of FIG. 5 is that a partial shiftamount of the mold 6 caused by the formation of the buffer film must betaken into consideration in the alignment correction logic, overlaycorrection amount, and abnormal value determination method whenperforming the imprint operation on the shot region 3.

FIG. 6 is a graph showing the driving profile of the mold stage in theimprint sequence of the JFIL method. As shown in FIGS. 8A and 8B, themold 6 is fixed to a mold chuck 14, and can be positioned in the Zdirection perpendicular to the pattern surface and in levelingdirections by the mold stage (not shown). In the imprint sequence, the Zposition of the mold stage is controlled based on a driving profile inwhich the time elapsed from the start of imprinting is plotted on theabscissa shown in FIG. 6. A driving profile 701 is a driving profilewhen no foreign substance 4 exists on the wafer 7. The controller C ofthe imprint apparatus drives the mold stage toward the surface of thewafer 7 at a high speed (first speed) from a retracted position ZE ofthe mold stage (a first step). The controller C then moves the patternsurface of the mold 6 closer to the wafer 7 by decreasing the drivingspeed to a low speed (second speed) in a position ZA2 spaced apart in anon-contact direction by a slight amount from the surface of the wafer 7(a second step). While the mold stage is driven by low-speed Z driving,the pattern surface of the mold 6 comes into contact with the surfacesof drops of the resin 5 dispensed on the surface of the wafer 7. Acounter force generated by this contact can be detected by monitoringthe current waveform of a linear motor or the like used in the moldstage. In an imprint filling sequence, the control mode is switched froma position control mode to a force control mode immediately after thiscounterforce is detected, and the mold 6 is pressed against the surfaceof the wafer 7 at a predetermined pressure (filling A). An imprintfilling period (filling A) is a waiting time in which the drops of theresin 5 dispensed on the wafer 7 spread and gaps between the dropsdisappear. After this imprint filling period, the resin 5 is cured byultraviolet irradiation from the non-pattern surface side of the mold 6(exposure). After the exposure, the mold 6 is driven away from the wafer7 and released from the pattern surface of the wafer 7, therebycompleting the imprint sequence of one shot region. The foregoing is thesequence when no foreign substance 4 exists on the surface of the wafer7.

It is, however, sometimes impossible to expectedly detect the foreignsubstance 4 existing on the wafer 7 due to marks or circuit patternsalready written on the underlying substrate. Therefore, it is possibleto implement a protecting function of monitoring the counterforce fromthe mold 6 immediately before the imprint operation is performed, thatis, in an interval during which the mold stage is moved down from ZE toZA2, and stopping driving in this interval if an unexpected counterforceis detected. To implement this protecting function, it is necessary tochange the Z-driving sequence of the mold stage in accordance with thepresence/absence of the foreign substance 4 on the wafer 7 (on thesubstrate). When the foreign substance 4 exists and the high-viscositymaterial 1 is dispensed, an end point ZA1 of the high-speed drivinginterval is set upward from the wafer 7 by an amount corresponding tothe film pressure of the high-viscosity material 1. That is, thecontroller C switches the first step of driving the mold 6 at the firstspeed as a high speed to the second step, such that the step (secondstep) of driving the mold 6 at the second speed as a low speed includesthe timing at which the pattern surface comes in contact with the filmof the high-viscosity material 1.

FIG. 7 shows an arrangement example of a plurality of imprint systems towhich the present invention is applicable. A plurality of imprintapparatuses 801 to 804 execute imprint processing based on the JFILmethod. A foreign substance inspection apparatus 805 inspects thepresence/absence of the foreign substance 4 on the wafer 7 before thewafer 7 is transported to the imprint apparatuses 801 to 804. Theforeign substance inspection apparatus 805 inspects the presence/absenceof the foreign substance 4 having a size of, for example, about 10 to0.1 μm, on the surface of the wafer 7 having no patterns formed on it,or on the surface of the wafer 7 having alignment marks and circuitpatterns formed on it. If the foreign substance 4 is detected, pieces ofinformation concerning an identification ID of the wafer 7 and theposition, size, and properties of the foreign substance 4 are recorded.These pieces of information are transmitted as additional information ofthe wafer 7 to be imprinted, to the imprint apparatuses 801 to 804 viacommunication paths 806 a to 806 d, respectively. On the other hand, atransporting mechanism 808 loads the inspected wafer 7 into each of theimprint apparatuses 801 to 804 via a transporting path 807. The foreignsubstance inspection apparatus 805 may also be incorporated into each ofthe imprint apparatuses 801 to 804. When the foreign substanceinspection apparatus 805 is incorporated, the foreign substance 4 can bedetected even if it adheres on the wafer 7 in an interval during whichthe wafer 7 is transported to each of the imprint apparatuses 801 to804. On the other hand, if the risk of adhesion of the foreign substance4 is low, or if the processability of the foreign substance inspectionapparatus 805 is high, the efficiency is increased by separating theforeign substance inspection apparatus 805 from the imprint apparatuses801 to 804 as shown in FIG. 7.

The imprint apparatus will be explained below with reference to FIGS. 8Aand 8B. The mold 6 as an original is held with its pattern surfacefacing down on the mold chuck 14 on the mold stage suspended from astructure 10 and movable in the Z direction and leveling directions (ωx,ωy). The wafer 7 is held with its transfer target surface facing up on awafer chuck on a wafer stage (substrate stage) 13 drivable in the X, Y,and θ directions. In the imprint sequence, the mold 6 held by the moldchuck 14 moves down. A dispenser (first coating device) 15 for coatingthe wafer 7 with a resin is a module including a plurality of micro jetnozzles arranged in one direction like a nozzle arrangement used in aninkjet printer. In a step of dispensing the resin 5 by the JFIL method,immediately before imprinting, the shot region 3 on the wafer 7 isscanned immediately below the dispenser 15 in a direction perpendicularto the nozzle array, thereby coating the shot region 3 with the resin 5.The syringe 2 coats the shot region 3 with the high-viscosity material 1as a resin that covers the foreign substance 4. Since the mechanism forapplying the high-viscosity material 1 is different from the dispenser15 for dispensing the resin 5, the high-viscosity materials 1 havingdifferent compositions can be selected. In addition, since the viscosityis high and the coating area is small, the high-viscosity material 1 isdispensed by using a single syringe type nozzle instead of an inkjettype nozzle having a small grain size. It is also possible to mount thesyringe 2 on the wafer stage 13, dispense the high-viscosity material 1to a portion of the mold 6 which corresponds to the portion contaminatedby the foreign substance 4 on the wafer 7, and transfer thehigh-viscosity material 1 dispensed on the mold 6 to the portioncontaminated by the foreign substance 4 on the wafer 7. The alignmentscope 9 is used to measure the die-by-die alignment marks 601, andmovable in the X and Y directions in accordance with the view angle ofthe shot region 3. An ultraviolet light source 11 generates ultravioletlight for curing the resin 5 after it is filled, and refracts theultraviolet light by a mirror 12, thereby irradiating the resin 5 fromthe non-pattern surface of the mold 6. FIG. 8B is a view showing theimprint apparatus from a surface A shown in FIG. 8A. A mesa surface 8rising toward the wafer 7 by a few 10 μm from the mold outer framesurface is formed on the mold 6, and patterns and the alignment marks601 are formed on the mesa surface 8. There are no important limitationson the positions of the syringe 2 and dispenser 15, provided that theydo not interfere with the mold chuck 14.

FIG. 11 shows an example of the film formation and imprint sequenceusing the JFIL method. The foreign substance inspection apparatus 805performs foreign substance inspection on the wafer 7 (step S21), andreports the result to the controller C of the imprint apparatus (stepS22). In step S23A, the controller C causes the syringe 2 to drop thehigh-viscosity material 1 in the detected position of the foreignsubstance 4 on the wafer 7. From step S24, a typical imprinting processbased on JFIL is performed. In step S25, the controller C causes thedispenser 15 to coat the wafer 7 with the light-curing resin 5 that is anormal resist. In step S26, the controller C causes the alignment scope9 to perform die-by-die measurement of the relative distancerelationship between the substrate-side marks 601 and mold-side marks(not shown), and corrects the target value of the wafer stage 13 so thata displacement amount obtained as the measurement result has apredetermined value. In step S28, the controller C performs an imprintoperation and exposure operation. In step S29, the controller C pulls upthe mold 6 to release it from the resin 5 cured by ultraviolet light.The steps from step S25 to step S29 described above are repeated by thenumber of shot regions arranged on the wafer 7.

Second Embodiment

FIG. 3 shows the second embodiment in which a film for protecting a moldis formed on a wafer 7 by using an imprint method of dispensing a resin5 by using a coater or the like outside an imprint apparatus. In thiscase, the imprint apparatus includes no dispenser 15 for dispensing anormal resin. In the second embodiment, a syringe 2 installed in theimprint apparatus to dispense a high-viscosity material 1 forms the filmbased on an inspection result from a foreign substance inspectionapparatus 805. Although the syringe 2 need not always be installed inthe imprint apparatus, it is realistic to install the syringe 2 in theimprint apparatus including an alignment mechanism because a function ofspecifying a location on the wafer 7 is necessary. In this method, asshown in FIG. 3, the high-viscosity material 1 is dispensed on the resin5 dispensed beforehand outside. FIG. 12 shows wafer processing in thesecond embodiment. The foreign substance inspection apparatus 805outside the imprint apparatus performs foreign substance inspection onthe wafer 7 (step S21), and reports the result to the imprint apparatus(step S22). In step S31, the resin 5 is dispensed by a coater outsidethe imprint apparatus and loaded into the imprint apparatus. In stepS23A, a controller C of the imprint apparatus dispenses the material 1on the wafer 7 loaded into the imprint apparatus. After that, an imprintprocessing loop is repeated for each shot region 3, and the controller Cperforms die-by-die alignment measurement in step S26 and alignmentcorrection driving in step S27. Then, the controller C repeats animprint operation (including imprinting and light irradiation) in stepS28 and a release operation in step S29 by the number of shot regions 3.Also, a method of writing and imprinting transfer patterns of one wafer7 has been proposed. In this method, the imprint processing loop afterthe high-viscosity material 1 is dispensed is replaced with simultaneouswafer imprint processing.

Third Embodiment

FIG. 9 shows the way a film for protecting a mold is formed in the thirdembodiment. In the third embodiment, a high-viscosity material 1 forforming the film is the same material as a resin 5, so there is nocoating mechanism for the high-viscosity material 1. If a foreignsubstance inspection apparatus 805 detects a foreign substance 4, acontroller C drops the normal resin 5 on the foreign substance portionin step S41, following the procedure of a repetitive coating processshown in FIG. 13. In step S42, the controller C simply cures the resin 5by ultraviolet irradiation without imprinting a mold 6. This step ofcuring the resin 5 by ultraviolet irradiation without imprinting themold 6 will be called open frame exposure (OFE). The controller Cperforms steps S41 and S42 once or a plurality of number of times,thereby forming a film 5S made of the cured material of the resin 5.After that, the controller C dispenses the normal resin 5 from adispenser in the same manner as that for other shot regions, therebyperforming an imprint operation. The method of the third embodiment iseffective when the viscosity of the normal resin 5 is too low and noexpected resin rising portion can be formed in the imprint operationeven if the dispensing amount of the resin 5 is increased.

Fourth Embodiment

FIG. 10 shows the way a film for protecting a mold is formed in thefourth embodiment. That is, the fourth embodiment uses both theformation of a film by open frame exposure shown in FIG. 9, and theformation of a film by using a number of drops of a high-viscositymaterial 1 explained with reference to FIG. 4. In step S11, a controllerC drops the high-viscosity material 1 around a foreign substance 4, andcures the high-viscosity material 1 by open frame exposure (5Sa). Instep S12, the controller C forms a thinner film around thehigh-viscosity material 1 in order to eliminate a steep step on thesurface of a wafer 7 (5Sb). In addition, the controller C drops a normalresin 5 in step S13, and performs an imprint operation in step S14. Asthe resin for forming the film, a resin having the same composition asthat of the normal resin 5 may also be used in accordance with the thirdembodiment.

Each method explained above can perform imprint processing using themold 6 within the designed range even when the foreign substance 4adheres to the wafer 7, and manufactures good chips from the chipregions 602 not contaminated by the foreign substance in the shot region3. In the present invention, it is only necessary to add the step ofdropping the high-viscosity material 1, which is complete within a shorttime period, so the productivity is not significantly decreased by, forexample, replacement of the mold 6.

[Article Manufacturing Method]

A method of manufacturing devices (for example, a semiconductorintegrated circuit device and liquid crystal display device) as articlesincludes a step of transferring (forming) patterns onto a substrate(wafer, glass plate, or film-like substrate) by using theabove-described imprint apparatus. This manufacturing method can furtherinclude a step of etching the substrate on which the patterns aretransferred. Note that when manufacturing another article such as apatterned medium (recording medium) or optical element, themanufacturing method can include another step of processing thesubstrate on which the patterns are transferred, instead of the etchingstep.

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2011-134453 filed Jun. 16, 2011, which is hereby incorporated byreference herein in its entirety.

1-17. (canceled)
 18. An imprint apparatus which performs imprintprocessing of forming a pattern by bringing a resin dispensed on asubstrate into contact with a mold, comprising: a mold stage which holdsthe mold; a substrate stage which holds the substrate; a dispensingdevice which dispenses the resin on the substrate on which a pluralityof chip regions are formed; and a controller, wherein said controllerobtains a result of foreign substance inspection conducted on thesubstrate, and, when the obtained result indicates existence of aforeign substance, controls said dispensing device, said mold stage, andsaid substrate stage, such that an operation of causing said dispensingdevice to dispense the resin on the substrate so as to increase theamount of the dispensed resin in the chip region, where the foreignsubstance exists, more than that in other chip regions, where theforeign substance does not exist.
 19. An imprint apparatus whichperforms imprint processing of forming a pattern by bringing a resindispensed on a substrate into contact with a mold, comprising: a moldstage which holds the mold; a substrate stage which holds the substrate;a first dispensing device which dispenses a resin on the substrate; anda second dispensing device which dispenses a material different from theresin, on the substrate for forming a film covering a foreign substance.20. The imprint apparatus according to claim 18, wherein the obtainedresult of foreign substance includes at least one of a position of theforeign substance and a size of the foreign substance.
 21. The imprintapparatus according to claim 19, wherein the second dispensing devicewhich dispenses the material before dispensing the resin on thesubstrate using the first dispensing device.
 22. The imprint apparatusaccording to claim 21, further comprising a controller, wherein thecontroller controls the second dispensing device which dispenses thematerial, and curing the material dispensed by the second dispensingdevice before the first dispensing device dispense the resin on thedispensed material.
 23. The imprint apparatus according to claim 19,wherein the material dispensed by the second dispensing device has aviscosity higher than that of the resin.
 24. The imprint apparatusaccording to claim 23, wherein the second dispensing device whichdispenses the material comprises a syringe.